EA6 - AddPower
Weight- and volume-reduced, space-conforming power electronics based on innovative substrate materials with additive 3D metallization and manufacturing techniques
As an indispensable key component of emission-free, resource-saving drives, power electronic assemblies strive for miniaturization, weight reduction, efficiency and installation space conformity. In the AddPower project, intelligent power modules based on fast-switching wide bandgap power semiconductors were integrated with three-dimensionally structured carrier substrates based on ceramic and metallic materials using additive and MID manufacturing processes.
Key data
Research Field
Mobility TechnologiesPeriod
01.05.2020 until 31.10.2021Project participants
-
KIT: Institut für Produktionstechnik (wbk, Prof. Schulze)
-
KIT: Institut für Prozessdatenverarbeitung und Elektronik (IPE, Prof. Weber)
-
Universität Stuttgart: Institut für Fertigungstechnologie keramischer Bauteile (IFKB, Apl. Prof. Kern)
-
Universität Stuttgart: Institut für Mikrointegration (IFM, Prof. Zimmermann)
-
Universität Stuttgart: Institut für Robuste Leistungshalbleitersysteme (ILH, Prof. Kallfass)