EA6 - AddPower

Weight- and volume-reduced, space-conforming power electronics based on innovative substrate materials with additive 3D metallization and manufacturing techniques

As an indispensable key component of emission-free, resource-saving drives, power electronic assemblies strive for miniaturization, weight reduction, efficiency and installation space conformity. In the AddPower project, intelligent power modules based on fast-switching wide bandgap power semiconductors were integrated with three-dimensionally structured carrier substrates based on ceramic and metallic materials using additive and MID manufacturing processes.

Key data

Research Field

Mobility Technologies

Period

01.05.2020 until 31.10.2021

Project participants

Contact

Marcel Noeller

Research Coordinator "Mobility Technologies"

Phone
+49 721 608 45636
E-Mail
fk@icm-bw.de